Microsys research and development fields

Microsys conducts inter-disciplinary and cross-disciplinary innovative R&D in cutting-edge fields:

Exploratory R&D in the field of microsystem (multiphysics and thermo-mechanical simulation, design in all aspects)
R&D in the field of micro-assembly and interconnect technology, organic electronic packaging and packaging for harsh environment
Pathfinding research on autonomous, wireless, energy harvesting and scavenger system
Microsystem design using off-the-shelf sensors and components, including packaged and bare die
Test and characterization (failure analysis, functionality test, life time and reliability test, climatic test, leak detection, electrical, etc.).