Laser patterning

8 μm tick aluminium foil   Features patterned on PCB

Whitin the frame of the Romisy project, Microsys developed expertise in the field of laser processing of metallic layers. We were able, e.g., to cut 8 μm thick aluminium foil without any thermal damages (on the left) and to pattern features on PCB that are much smaller than the copper thickness (on the right).

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Last update on June 20, 2017