Reflow and curing oven

Reflow oven

Description

The reflow oven LPKF Protoflow S is for reflow and curing electronic assembly.

Capacities

  • Reflow atmosphere: inert gas and forming gas
  • Process temperature of 30 - 320°C
  • Controlled by PC
  • Work piece dimensions: 230 x 305 mm².

Applications

Reflow oven performs reflow of different solders (including lead-free), curing varieties of adhesives.

back
Valid XHTML 1.0 Strict

Last update on July 20, 2015