Pick & Place (MAT)

MAT

Description

MAT 6497 semi-automatic "pick and place" tool is dedicated for accurate mounting semiconductor components on all type of substrates.

Capacities

  • Placement of component of lateral dimensions of 250 μm and larger up to 10x10 mm²
  • Patterning recognition software
  • Flip-chip operation: thermo-sonic and thermo-compression
  • Adhesive and solder automatic dispensing
  • X, Y and Z motorized table and head rotation
  • Operating mode: manual and semi-automatic
  • Placement accuracy: ±5 μm.

Applications

The semi-automatic "pick and place" MAT 6497 performs mounting of electronic components as SMD, bare die, BGA and micro BGA.

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Last update on July 20, 2015