Hermetic sealing oven

Hermetic sealing oven

Description

The oven performs solder reflow, adhesive curing and hermetic sealing of electronic package in controlled atmosphere. The oven suits for prototyping.

Capacities

  • Gas flow: nitrogen, helium or forming gas
  • Stage temperature: 25 to 350°C
  • Controlled by PC
  • Work piece size: 110 x 110 mm².
back
Valid XHTML 1.0 Strict

Last update on July 20, 2015