Decapsulation

Decapsulation

Description

The chemical decapsulation system is dedicated for decapsulation of plastic electronic packages. The decapsulation is necessary to analyze the silicon die.

Capacities

  • Process liquid: nitric, sulfuric and mixes
  • Temperature: from 40 to 250°C
  • Flow rate: from 2 to 10 ml/min
  • Mask and accessories for decapsulation of all types of packaging (included BGA and micro BGA).
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Last update on July 20, 2015