Submicron Die and Flip Chip bonder

Submicron Die and Flip Chip bonder


The flexible FINEPLACER® lambda system from Finetech is a sub-micron die-bonder for high precision die attach and advanced chip packaging.


  • Automated processes (temperature, force) and Integrated Process Management
  • Real time process observation camera
  • Placement of component of lateral dimensions of 250 μm and larger up to 10x10 mm²
  • Thermo-compression bonding including flip-chip (maximum force of 10 kg)
  • Soldering technique (lead-free, AuSn, Indium, etc.)
  • Adhesive technology
  • Rework option
  • Patterning recognition software
  • X, Y and Z work table and head rotation
  • Placement accuracy: ±0.5 μm
  • Suitable for formic acid with maximum concentration of 85%.


Typical fields of application include R&D, prototyping and low-volume production. The system handles a wide range of applications, including:

  • CMOS precise flip chip and die bonding
  • Sensor and MEMS packaging
  • Micro optics assembly and multi-stage assembly of opto-electro mechanical systems (MOEMS)
  • Laser bar, LED, VCSEL/photo diode bonding
  • Chip on glass, chip on flex.
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Last update on January 15, 2021