Automatic wire bonder: wedge and ball bonding

Automatic wire bonder: wedge and ball bonding

Description

The Hesse BJ653 is a fully automatic changeable bondheads machine for thermo- and ultra- sonic Au and Al wire bonding. The machine suits for prototyping as well as for mass production.

Capacities

  • Types of welding: ball-wedge, stud ball bumping, wedge-wedge
  • Operational frequency: 94 kHz, dual-frequency: 60/120 kHz
  • Wires: aluminum and gold of 18 to 75 μm diameter
  • Force range: 10 to 150 cN
  • Ultrasonic power: 0.1 to 2.5 W
  • X, Y and Z motorized axis
  • 440° rotating head
  • Programmed loop shape.

Applications

The machine performs the Au and Al wire-bonding: die to package and die to PCB (chip on board), die to die (stacked IC), stud ball bumping.

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Last update on January 15, 2021