Hermetic sealing oven

Hermetic sealing oven


The oven performs solder reflow, adhesive curing and hermetic sealing of electronic package in controlled atmosphere. The oven suits for prototyping.


  • Gas flow: nitrogen, helium or forming gas
  • Stage temperature: 25 to 350°C
  • Controlled by PC
  • Work piece size: 110 x 110 mm².
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Last update on January 15, 2021