Decapsulation

Description

The chemical decapsulation system is dedicated for decapsulation of plastic electronic packages. The decapsulation is necessary to analyze the silicon die.

Capacities

Process liquid: nitric, sulfuric and mixes
Temperature: from 40 to 250°C
Flow rate: from 2 to 10 ml/min
Mask and accessories for decapsulation of all types of packaging (included BGA and micro BGA).